util/gen_spd: translate DeviceBusWidth to die bus width

If a memory part is a x16 part that has two dies and only a single
rank, then the x16 describes the part width (since this solution will
need to be a stacked solution) and as such, we must translate the
DeviceBusWidth to the "die bus width" instead.

Change DeviceBusWidth variable name to PackageBusWidth to be more
descriptive

BUG=b:166645306, b:160157545
TEST=run gen_spd and verify that spds for parts matching description
above changed appropriately.

Change-Id: Ia6f3ca109d344b7a015da28125a94ce10d2bdfb8
Signed-off-by: Nick Vaccaro <nvaccaro@google.com>
Reviewed-on: https://review.coreboot.org/c/coreboot/+/44870
Tested-by: build bot (Jenkins) <no-reply@coreboot.org>
Reviewed-by: Furquan Shaikh <furquan@google.com>
This commit is contained in:
Nick Vaccaro
2020-08-27 11:44:38 -07:00
committed by Aaron Durbin
parent 2afee12991
commit 913ea9278f
4 changed files with 36 additions and 18 deletions

View File

@ -59,7 +59,7 @@ Input JSON file requires the following two fields for every memory part:
* `diesPerPackage`: Number of dies on the part. Valid values:
`1, 2` dies per package.
* `deviceBusWidth`: Number of bits of the device's address bus. Valid values:
* `packageBusWidth`: Number of bits of the device's address bus. Valid values:
`8, 16` bit-wide bus. NOTE: Width of x4 is not supported by this tool.
* `ranksPerPackage`: From Jedec doc 4_01_02_AnnexL-1R23:
@ -145,7 +145,7 @@ string like "9 10 11 12 14".
"CL_nRCD_nRP": 22
"capacityPerDieGb": 8,
"diesPerPackage": 2,
"deviceBusWidth": 16,
"packageBusWidth": 16,
"ranksPerPackage": 1,
}
},
@ -156,7 +156,7 @@ string like "9 10 11 12 14".
"CL_nRCD_nRP": 22
"capacityPerDieGb": 8,
"diesPerPackage": 1,
"deviceBusWidth": 16,
"packageBusWidth": 16,
"ranksPerPackage": 2,
"casLatencies": "9 10 11 12 13 14 15 16 17 18 19 20",
"tCKMaxPs": "1250"