Duggapu Chinni B
543add1d41
IntelFsp2Pkg: Fsp T new ARCH UPD Support
...
Changes to support spec changes
1. Remove usage of Pcd.
2. Change code to validate the Temporary Ram size input.
3. Consume the input saved in YMM Register
Cc: Sai Chaganty <rangasai.v.chaganty@intel.com >
Cc: Nate DeSimone <nathaniel.l.desimone@intel.com >
Cc: Chiu Chasel <chasel.chiu@intel.com >
Cc: Duggapu Chinni B <chinni.b.duggapu@intel.com >
Cc: Ni Ray <ray.ni@intel.com >
Signed-off-by: Duggapu Chinni B <chinni.b.duggapu@intel.com >
Reviewed-by: Chiu Chasel <chasel.chiu@intel.com >
Reviewed-by: Nate DeSimone <nathaniel.l.desimone@intel.com >
2024-04-09 17:15:10 +00:00
Chasel Chiu
df25a5457f
IntelFsp2Pkg: Add FSP 2.4 MultiPhase interface.
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REF: https://bugzilla.tianocore.org/show_bug.cgi?id=3916
Provide FSP 2.4 MultiPhase interface and scripts
support.
Cc: Nate DeSimone <nathaniel.l.desimone@intel.com >
Cc: Star Zeng <star.zeng@intel.com >
Signed-off-by: Chasel Chiu <chasel.chiu@intel.com >
Reviewed-by: Nate DeSimone <nathaniel.l.desimone@intel.com >
2022-08-31 16:48:07 +00:00
Chasel Chiu
5a3641bfcd
IntelFsp2Pkg: Add FSPI_ARCH_UPD.
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REF: https://bugzilla.tianocore.org/show_bug.cgi?id=3993
Adding the missing FSPI_ARCH_UPD, FSP_GLOBAL_DATA_VERSION bumpping up,
and some comments for clarification.
Also fixed a bug in SplitFspBin.py for FSP-I support.
Cc: Nate DeSimone <nathaniel.l.desimone@intel.com >
Cc: Star Zeng <star.zeng@intel.com >
Signed-off-by: Chasel Chiu <chasel.chiu@intel.com >
Reviewed-by: Nate DeSimone <nathaniel.l.desimone@intel.com >
2022-07-22 18:13:19 +00:00
Hongbin1 Zhang
4824924377
IntelFsp2Pkg/FspSecCore: Add FSP-I API for SMM support.
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REF: https://bugzilla.tianocore.org/show_bug.cgi?id=3993
Add FSP-I API entry point for SMM support.
Also update 64bit API entry code to assign ApiIdx to RAX
to avoid confusion.
Cc: Nate DeSimone <nathaniel.l.desimone@intel.com >
Cc: Star Zeng <star.zeng@intel.com >
Signed-off-by: Chasel Chiu <chasel.chiu@intel.com >
Signed-off-by: Hongbin1 Zhang <hongbin1.zhang@intel.com >
Reviewed-by: Nate DeSimone <nathaniel.l.desimone@intel.com >
2022-07-20 02:15:55 +00:00
Chasel Chiu
140446cd59
IntelFsp2Pkg: Support 64bit FspResetType for X64 build.
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REF: https://bugzilla.tianocore.org/show_bug.cgi?id=3999
FspResetType will be either 32bit or 64 bit basing on
the build type.
Cc: Nate DeSimone <nathaniel.l.desimone@intel.com >
Cc: Star Zeng <star.zeng@intel.com >
Signed-off-by: Chasel Chiu <chasel.chiu@intel.com >
Reviewed-by: Nate DeSimone <nathaniel.l.desimone@intel.com >
2022-07-19 22:24:31 +00:00
Ted Kuo
6f219bef55
IntelFsp2Pkg: Add FSPx_ARCH2_UPD support for X64
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REF:https://bugzilla.tianocore.org/show_bug.cgi?id=3893
1.Added FSPx_ARCH2_UPD structures which support both IA32 and X64.
2.Added FSPx_UPD_COMMON_FSP24 structures.
Cc: Chasel Chiu <chasel.chiu@intel.com >
Cc: Nate DeSimone <nathaniel.l.desimone@intel.com >
Cc: Star Zeng <star.zeng@intel.com >
Cc: Ashraf Ali S <ashraf.ali.s@intel.com >
Signed-off-by: Ted Kuo <ted.kuo@intel.com >
Reviewed-by: Chasel Chiu <chasel.chiu@intel.com >
Reviewed-by: Nate DeSimone <nathaniel.l.desimone@intel.com >
2022-04-16 00:18:14 +00:00
Michael Kubacki
111f2228dd
IntelFsp2Pkg: Apply uncrustify changes
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REF: https://bugzilla.tianocore.org/show_bug.cgi?id=3737
Apply uncrustify changes to .c/.h files in the IntelFsp2Pkg package
Cc: Andrew Fish <afish@apple.com >
Cc: Leif Lindholm <leif@nuviainc.com >
Cc: Michael D Kinney <michael.d.kinney@intel.com >
Signed-off-by: Michael Kubacki <michael.kubacki@microsoft.com >
Reviewed-by: Chasel Chiu <chasel.chiu@intel.com >
2021-12-07 17:24:28 +00:00
Chasel Chiu
89f569ae8e
IntelFsp2Pkg: Add FSP*_ARCH_UPD.
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REF: https://bugzilla.tianocore.org/show_bug.cgi?id=2781
Introduce FSPT_ARCH_UPD and FSPS_ARCH_UPD to support debug events
and multi-phase silicon initialization.
For backward compatibility the original structures are kept and
new ARCH_UPD structures will be included only when UPD header
revision equal or greater than 2.
GenCfgOpt script also updated to prevent from generating duplicate
FSPT_ARCH_UPD and FSPS_ARCH_UPD typedef structures.
Cc: Maurice Ma <maurice.ma@intel.com >
Cc: Nate DeSimone <nathaniel.l.desimone@intel.com >
Cc: Star Zeng <star.zeng@intel.com >
Signed-off-by: Chasel Chiu <chasel.chiu@intel.com >
Reviewed-by: Nate DeSimone <nathaniel.l.desimone@intel.com >
2020-06-23 04:22:49 +00:00
Chasel Chiu
f2cdb268ef
IntelFsp2Pkg: Support Multi-Phase SiInit and debug handlers.
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REF: https://bugzilla.tianocore.org/show_bug.cgi?id=2698
To enhance FSP silicon initialization flexibility an optional
Multi-Phase API is introduced and FSP header needs update for
new API offset. Also new SecCore module created for
FspMultiPhaseSiInit API
New ARCH_UPD introduced for enhancing FSP debug message
flexibility now bootloader can pass its own debug handler
function pointer and FSP will call the function to handle
debug message.
To support calling bootloader functions, a FspGlobalData field
added to indicate if FSP needs to switch stack when FSP running
on separate stack from bootloader.
Cc: Maurice Ma <maurice.ma@intel.com >
Cc: Nate DeSimone <nathaniel.l.desimone@intel.com >
Cc: Star Zeng <star.zeng@intel.com >
Signed-off-by: Chasel Chiu <chasel.chiu@intel.com >
Reviewed-by: Nate DeSimone <nathaniel.l.desimone@intel.com >
2020-05-14 12:34:01 +00:00
Antoine Cœur
91cc60bafc
IntelFsp2Pkg: Fix various typos
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Fix various typos in IntelFsp2Pkg.
Signed-off-by: Cœur <coeur@gmx.fr >
Reviewed-by: Star Zeng <star.zeng@intel.com >
Reviewed-by: Chasel Chiu <chasel.chiu@intel.com >
2019-07-11 21:07:17 +08:00
Antoine Cœur
efa12a3f02
Revert "FmpDevicePkg: Fix various typos"
...
This reverts commit f527942e6b
.
Commit message was incorrect.
Signed-off-by: Cœur <coeur@gmx.fr >
Reviewed-by: Chasel Chiu <chasel.chiu@intel.com >
2019-07-11 21:07:16 +08:00
Antoine Cœur
f527942e6b
FmpDevicePkg: Fix various typos
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Fix one typo in FmpDevicePkg.
Signed-off-by: Cœur <coeur@gmx.fr >
Reviewed-by: Star Zeng <star.zeng@intel.com >
Reviewed-by: Chasel Chiu <chasel.chiu@intel.com >
2019-07-09 21:40:00 +08:00
Michael D Kinney
9672cd3056
IntelFsp2Pkg: Replace BSD License with BSD+Patent License
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https://bugzilla.tianocore.org/show_bug.cgi?id=1373
Replace BSD 2-Clause License with BSD+Patent License. This change is
based on the following emails:
https://lists.01.org/pipermail/edk2-devel/2019-February/036260.html
https://lists.01.org/pipermail/edk2-devel/2018-October/030385.html
RFCs with detailed process for the license change:
V3: https://lists.01.org/pipermail/edk2-devel/2019-March/038116.html
V2: https://lists.01.org/pipermail/edk2-devel/2019-March/037669.html
V1: https://lists.01.org/pipermail/edk2-devel/2019-March/037500.html
Contributed-under: TianoCore Contribution Agreement 1.1
Signed-off-by: Michael D Kinney <michael.d.kinney@intel.com >
Reviewed-by: Chasel Chiu <chasel.chiu@intel.com >
2019-04-09 10:58:03 -07:00
Liming Gao
e37bb20c7b
IntelFsp2Pkg: Clean up source files
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1. Do not use tab characters
2. No trailing white space in one line
3. All files must end with CRLF
Contributed-under: TianoCore Contribution Agreement 1.1
Signed-off-by: Liming Gao <liming.gao@intel.com >
2018-06-28 11:19:43 +08:00
Giri P Mudusuru
190895683a
IntelFsp2Pkg: Add missing OEM status code defines.
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Adding defines from FSP EAS v2.0 section 11.2.2 Oem Status code.
Cc: Jiewen Yao <jiewen.yao@intel.com >
Cc: Maurice Ma <maurice.ma@intel.com >
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Giri P Mudusuru <giri.p.mudusuru@intel.com >
Reviewed-by: Jiewen Yao <Jiewen.yao@intel.com >
Reviewed-by: Maurice Ma <maurice.ma@intel.com >
2016-06-01 13:27:28 -07:00
Jiewen Yao
6d0ac98825
IntelFsp2Pkg/FspApi.h: Add comment for structure definition.
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Add doxygen style comment for structure definition.
Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com >
Cc: Satya P Yarlagadda <satya.p.yarlagadda@intel.com >
Cc: Maurice Ma <maurice.ma@intel.com >
Cc: Ravi P Rangarajan <ravi.p.rangarajan@intel.com >
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Jiewen Yao <jiewen.yao@intel.com >
Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com >
2016-05-20 08:46:58 +08:00
Jiewen Yao
cf1d454983
Add IntelFsp2Pkg and IntelFsp2WrapperPkg.
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Add FSP2.0 support.
This series of patch is to support FSP2.0 specification at
https://firmware.intel.com/sites/default/files/FSP_EAS_v2.0_Draft%20External.pdf
Some major updates include:
1) One FSP binary is separated to multiple components:
FSP-T, FSP-M, FSP-S, and optional FSP-O.
Each component has its own configuration data region.
2) All FSP-APIs use same UPD format - FSP_UPD_HEADER.
3) Add EnumInitPhaseEndOfFirmware notifyphase.
4) FSP1.1/FSP1.0 compatibility is NOT maintained.
5) We also add rename Fsp* to FspWrapper* in IntelFsp2WrapperPkg,
to indicate that it is for FspWrapper only.
IntelFspPkg and IntelFspWrapperPkg will be deprecated.
The new Intel platform will follow FSP2.0 and use IntelFsp2Pkg
and IntelFsp2WrapperPkg.
The old platform can still use IntelFspPkg and IntelFspWrapperPkg
for compatibility consideration.
Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com >
Cc: Maurice Ma <maurice.ma@intel.com >
Cc: Ravi P Rangarajan <ravi.p.rangarajan@intel.com >
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Jiewen Yao <jiewen.yao@intel.com >
Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com >
Reviewed-by: Maurice Ma <maurice.ma@intel.com >
Reviewed-by: Ravi P Rangarajan <ravi.p.rangarajan@intel.com >
2016-05-13 13:00:53 +08:00