REF:https://bugzilla.tianocore.org/show_bug.cgi?id=3476
parseInfFile currently reading the EFI_BASE_ADDRESS from INF, once the
address found still it's continues to read the complete inf file which
is not required. once the EFI_BASE_ADDRESS read from the INF no need to
read the INF further.
MSFT compiler can generate the map file address 8 or 16 based on which
architecture the INF is compiler. currently it's support for IA32,
modified the patchfv to support for all.
modification of few typo errors in parseModMapFile, getCurr function
required
verification : Working Fine
Signed-off-by: Ashraf Ali S <ashraf.ali.s@intel.com>
Cc: Ray Ni <ray.ni@intel.com>
Cc: Chasel Chiu <chasel.chiu@intel.com>
Cc: Nate DeSimone <nathaniel.l.desimone@intel.com>
Cc: Star Zeng <star.zeng@intel.com>
Reviewed-by: Chasel Chiu <chasel.chiu@intel.com>
1. Do not use tab characters
2. No trailing white space in one line
3. All files must end with CRLF
Contributed-under: TianoCore Contribution Agreement 1.1
Signed-off-by: Liming Gao <liming.gao@intel.com>
Add FSP2.0 support.
This series of patch is to support FSP2.0 specification at
https://firmware.intel.com/sites/default/files/FSP_EAS_v2.0_Draft%20External.pdf
Some major updates include:
1) One FSP binary is separated to multiple components:
FSP-T, FSP-M, FSP-S, and optional FSP-O.
Each component has its own configuration data region.
2) All FSP-APIs use same UPD format - FSP_UPD_HEADER.
3) Add EnumInitPhaseEndOfFirmware notifyphase.
4) FSP1.1/FSP1.0 compatibility is NOT maintained.
5) We also add rename Fsp* to FspWrapper* in IntelFsp2WrapperPkg,
to indicate that it is for FspWrapper only.
IntelFspPkg and IntelFspWrapperPkg will be deprecated.
The new Intel platform will follow FSP2.0 and use IntelFsp2Pkg
and IntelFsp2WrapperPkg.
The old platform can still use IntelFspPkg and IntelFspWrapperPkg
for compatibility consideration.
Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Cc: Maurice Ma <maurice.ma@intel.com>
Cc: Ravi P Rangarajan <ravi.p.rangarajan@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Jiewen Yao <jiewen.yao@intel.com>
Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Reviewed-by: Maurice Ma <maurice.ma@intel.com>
Reviewed-by: Ravi P Rangarajan <ravi.p.rangarajan@intel.com>
