Add gIntelSmbiosDataHobGuid used to publish SMBIOS data from PEI phase.
The HOB data format will be same as SMBIOS spec define formats for
Types 0 to 127 and OEM defined types for 128 to 255.
Generic library or DXE driver can add SMBIOS records using this HOB(s).
Cc: Jiewen Yao <jiewen.yao@intel.com>
Cc: Star Zeng <star.zeng@intel.com>
Cc: Michael Kinney <michael.d.kinney@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Reviewed-by: Jiewen Yao <jiewen.yao@intel.com>
Reviewed-by: Star Zeng <star.zeng@intel.com>
Adding Intel Firmware Version Info (FVI) related defines & structures.
FVI enables reporting the Firmware Versions using SMBIOS OEM Type.
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Reviewed-by: Jiewen Yao <jiewen.yao@intel.com>
Reviewed-by: Star Zeng <star.zeng@intel.com>
Renamed INTEL_IGD_* to IGD_* and IGD_OPREGION_VBT to IGD_OPREGION_MBOX4
to make it consistent with file name and other mailbox naming.
Cc: Jiewen Yao <jiewen.yao@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Reviewed-by: Jiewen Yao <jiewen.yao@intel.com>
1) Fixed the VBT size from 0x1C00(7KB) to 0x1800(6KB) and typos, indentation
2) Updated offsets in hex values and offset from start of OPREGION
Cc: Jiewen Yao <jiewen.yao@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Reviewed-by: Jiewen Yao <jiewen.yao@intel.com>
This package will include open source common Intel silicon related modules.
Cc: Giri P Mudusuru <giri.p.mudusuru@intel.com>
Contributed-under: TianoCore Contribution Agreement 1.0
Signed-off-by: Jiewen Yao <jiewen.yao@intel.com>
Reviewed-by: Giri P Mudusuru <giri.p.mudusuru@intel.com>
