Intel Firmware Support Package 2.4 specification (document 736809)
brings some significant changes compared to version 2.3 (document
644852):
1. It supports FSP-M multi-phase init. Some fields have been added to
the FSP header data structure for this purpose.
2. The `FSPM_ARCH2_UPD' and `FSPS_ARCH2_UPD' data structures must be
used in place of `FSPM_ARCH_UPD' and `FSPS_ARCH_UPD' respectively.
3. It support 64-bits FSP but 64-bits support will be provided by
subsequent patch.
Note that similarly to what is done for silicon initialization,
timestamps and post-codes are used during the memory initialization
multi-phase.
[736809]
https://cdrdv2-public.intel.com/736809/736809_FSP_EAS_v2.4_Errata_A.pdf
[644852]
https://cdrdv2-public.intel.com/644852/644852_2.3_Firmware-Support-Package-External-Architecture-Specification.pdf
TEST=verified on Lunar Lake RVP board (lnlrvp)
Change-Id: I1c24d26e105c3dcbd9cca0e7197ab1362344aa97
Signed-off-by: Jeremy Compostella <jeremy.compostella@intel.com>
Reviewed-on: https://review.coreboot.org/c/coreboot/+/80275
Tested-by: build bot (Jenkins) <no-reply@coreboot.org>
Reviewed-by: Lean Sheng Tan <sheng.tan@9elements.com>
Reviewed-by: Subrata Banik <subratabanik@google.com>
Reviewed-by: Dinesh Gehlot <digehlot@google.com>
1879b6a34a